Printed Circuit Board Adhesive Formula

Component dosage /g component dosage /g
V220SH Nitrile 45 Zinc White S 2
PR11078 Phenolic resin 25 (rubber) vulcanizing agent 2
EP1--7 epoxy resin 15 stearic acid 1
Calcium silicate 5 lecithin 2
Calcium Carbonate 3 Methyl Ethyl Ketone (2-Butanone) 300

preparation
The above ingredients were mixed at 70° C. for 5 h, coated on aluminum foil, and dried at 150° C. for 30 min. The laminated laminate of 8-layer phenolic resin oil-impregnated paper is covered with an aluminum foil coated with the binder and laminated and formed.

Use The glue has excellent heat resistance during welding and has excellent adhesion to metal such as copper foil. Used in the manufacture of printed circuit boards, bonding laminates of thermosetting resins and paper to copper or aluminum foils.


Source: 21st Century Fine Chemicals Network

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