Adhesive Patent Introduction Topics 1-8

Block copolymers for hot melt adhesives wO 2000 39223 (2000-07-06)

The block copolymer has at least two A segments in one B segment in the composition, and both A and B blocks are derived from monovinylically unsaturated monomers; 2) at least 40 parts of a tackifier. The hot melt of this patent can be used in pressure-sensitive adhesives or heat-activated adhesives. Its formulation range is wide, and it has sufficient cohesive strength for high performance applications. For example, a block copolymer obtained by copolymerization of tert-butyl acrylate and methacrylate can be made into a hot-melt adhesive by inverse esterification with isopropyl alcohol and a tackifier.

Easy tearing plastic pressure-sensitive adhesive using a cycloolefin polymer substrate JP 2000 191990 (2000- 07-11)

The tape has a cycloolefin polymer layer with an optional polyolefin layer on one or both faces and a pressure sensitive adhesive layer on one or both surfaces. For example, a Zeonex film (cycloolefin polymer) having a thickness of 30 μm is corona-treated; the pressure-sensitive adhesive contains butyl rubber, ester gum, and lanolin. The resulting tape has a high mechanical strength, good flexibility and excellent storage stability under humid conditions.

Remoisture-breaking system DE l9901828 (2000-07-20)

This adhesive has good storage stability and can be quickly activated. It is a dispersible colloid of a water-soluble polymer, and a water insoluble monomer is initiated with AIBN in the presence of 23 g of Emulsogen EPN 287 (fatty alcohol polyglycol ether) in the presence of a granulating emulsifier and 497 g of water. 300 g of N-vinylpyrrolidone and 100 g of 2-ethylhexyl acrylate were copolymerized to give a colloidal dispersion having a solids content of 30.3% and a K value of 66. This patent also lists application examples of the glue.

Photocuring adhesive for recording disks WO 2000 42115 (2000- 07-20)

1 The photocurable resin composition includes: 1) a cationically polymerizable organic compound, and 2) an organic tin compound, because the adhesive has excellent moisture resistance and heat resistance, so that it is more effective than conventional adhesives. Suitable for making optical discs. For example, one photocurable adhesive contains 60 parts of KRM 2110, 20 parts of Epilite 4000, 2 parts of Adekao sp170, 20 parts of Sunnix GP250, and 1 part of dibutyltin dilaurate.

Formaldehyde-free Adhesive for Adhesive Plates JP 2000 204106 (2000-07-25)

The gum contains: A) an emulsion prepared from vinyl acetate (1) 80.0% to 99.9%, or a mixture of I-(meth)acrylate and O. 1%-20% Acrylic Acid (2) Emulsion prepared in the presence of a modified ethylene leavening copolymer. B) A copolymer emulsion of I-(meth)acrylate-II. For example, a plywood adhesive composition is: I and II mass ratio of 395:5 copolymer emulsion, using it made plywood soaked in 60 °C water for 3h, still has good adhesion, and good thermal shock resistance.
High-viscosity acrylic vinegar adhesive for paper core tube manufacturing JP 2000 204340 (2000-07-25)
The adhesive has 100 parts of acrylate emulsion, 80-170 parts of inorganic fillers, 30-70 parts of PVA containing carbon groups, 0.2-5 parts of terpenoids, and 50 parts of terpenoids (based on 100 parts of terpenoids). ) Amines. For example, this gel contains 100 parts of S-Dinel68 (acrylic vinegar solution), 125 parts of ASP600 (clay), 55 parts of D-polymer (carbonyl containing PVA), 3 parts of adipic acid dihydrazide, 6 isopropylamine. Parts, Me2CO 7.5 parts, (viscosity 40mPaos, solid content 27%), the adhesive strength of this adhesive to paper: 0.84, 1.72, 2.70kg after bonding 6, 8, 10s respectively. Cm-2, but also has good water resistance, heat resistance and storage stability.

Heat-resistant isocyanate adhesive containing heat stabilizer US 6093780 (2000-07025)

The glue contains thermal stabilizers such as alkylating agents, silylating agents, and α-cyanoacrylates. For example, an adhesive containing 100 parts of ethyl α-cyanoacrylate, 10 parts of poly(ethylene-benzyl chloride), which has a decomposition starting humidity of 189°C, and a mass loss of 30% after heating at 150°C for 900 minutes, accelerates Storage life is (82 °C) 20d.
Anisotropic conductive adhesive JP 2000 207942 (2000-07-28)
The glued A) epoxy resin, B) curing agent, C) gold-plated nickel powder. This type of conductive adhesive is particularly suitable for connection of flip chips in electrical equipment, and it can also be used to make low-resistance contacts on IT housings.